Henkel LOCTITE® Bergquist®

Gap Pad® 1500

导热、非强化填隙材料

Bergquist 的 Gap Pad® 1500 图片 Bergquist 的 Gap Pad® 1500 具有理想填料融合性能，能够让该器件实现低模量特性，保持最佳的热性能，且仍易于搬运。 材料两侧均具有天然粘性，对相邻元件表面具有良好顺应性，最大程度地缩小了界面阻力。

特性

  • 导热率：1.5 W/m-K
  • 针对附加规范的非强化结构
  • 顺应性、低硬度
  • 电隔离

应用

  • 电信
  • 计算机及外设
  • 电源转换
  • RDRAM 存储器模块/芯片级封装
  • 需要将热转移到框架、机箱或其它类型散热器的表面

Gap Pad 1500

图片制造商零件编号描述类型形状外形可供货数量查看详情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.020-02-0404THERM PAD 101.6MMX101.6MM BLACK垫，片材方形101.60mm x 101.60mm113 - 立即发货查看详情
THERM PAD 406.4X203.2MM BLACKGP1500-0.080-02-0816THERM PAD 406.4X203.2MM BLACK垫，片材矩形406.40mm x 203.20mm106 - 立即发货查看详情
THERM PAD 406.4X203.2MM BLACKGP1500-0.060-02-0816THERM PAD 406.4X203.2MM BLACK垫，片材矩形406.40mm x 203.20mm29 - 立即发货查看详情
THERM PAD 406.4X203.2MM BLACKGP1500-0.125-02-0816THERM PAD 406.4X203.2MM BLACK垫，片材矩形406.40mm x 203.20mm91 - 立即发货查看详情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.040-02-0404THERM PAD 101.6MMX101.6MM BLACK垫，片材方形101.60mm x 101.60mm56 - 立即发货查看详情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.060-02-0404THERM PAD 101.6MMX101.6MM BLACK垫，片材方形101.60mm x 101.60mm66 - 立即发货查看详情
THERM PAD 406.4X203.2MM BLACKGP1500-0.040-02-0816THERM PAD 406.4X203.2MM BLACK垫，片材矩形406.40mm x 203.20mm10 - 立即发货查看详情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.080-02-0404THERM PAD 101.6MMX101.6MM BLACK垫，片材方形101.60mm x 101.60mm49 - 立即发货查看详情
THERM PAD 15MMX15MM BLACKGP1500-0.125-02-15MMX15MMTHERM PAD 15MMX15MM BLACK填隙垫，片材方形15.00mm x 15.00mm32 - 立即发货查看详情
THERM PAD 101.6MMX101.6MM BLACKGP1500-0.125-02-0404THERM PAD 101.6MMX101.6MM BLACK垫，片材方形101.60mm x 101.60mm0 - 立即发货查看详情
THERM PAD 406.4X203.2MM BLACK2166082THERM PAD 406.4X203.2MM BLACK垫，片材矩形406.40mm x 203.20mm0 - 立即发货查看详情
发布日期： 2013-10-07

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