Tanstep Technology

About

Our mission is to deliver world class safe & secure edge AI IoT solutions to help our customers to grow their business. Tanstep has very experienced engineering team in complicated embedded system solution development. The core team members have ever worked for Cisco, NXP, Continental etc and have well-proven record on high-quality embedded products development, providing professional support, and tens million mass production delivery to global service providers, OEMs, Tier1s. Our edge AI high-performance computing controllers (Edge iHPC) and AI sensors (Edge iSense) are developed based on NXP’s latest MPU SOC, MCU, PMIC and advanced analog chips, such as i.MX9, S32K, S32G, S32Z, FS/PF PMICs etc. These solutions can support multiple safe and secure edge AI applications such as AI IoT, industrial automation, AI robots, intelligent vehicles and motorcycles, medical platform, intelligent cities, energy systems etc. Our solutions could help our partners and customers to ease their new product development, reduce R&D cost, accelerate TTM, and win more business.

With years of extensive experience in the development and delivery of software and hardware products and system solutions such as automated driving, IoT, multimedia digital terminals, etc., the team has a long-standing track record of providing world-class solutions, high-quality products and professional support to global car OEMs, Tier 1 and Tier 2 suppliers, and global radio, television and telecom service providers. The company's core team has experience in mass production and delivery of products on a large scale of tens million level.

Tanstep was founded in March 2022 in Shanghai, China, with headquarters in Pudong, Shanghai, and branches in Chongqing and Chengdu.

Core Competencies:

  • Safe and secure AI IoT solution development including HW, SW
  • Deep learning, Computer version
  • NXP chipsets and SDKs such as i.MX9, S32K, S32G, S32Z, PMIC etc.
  • Security, Safety, Networking, Linux, RTOS, BSP etc.
  • HW cost-down design
  • ASIC
  • Audio
  • Ethernet
  • General Digital/Analog
  • High Density/BGA
  • PCB Design/Layout
  • Power Supply
  • Robotics
  • USB
  • Video
  • High Volume Production
  • Low to Medium Volume Production
  • Prototype Assembly
  • Prototype Testing
  • Rapid Prototyping
  • Turnkey Volume Production
  • Enclosure Design
  • Full Product 3D Modeling
  • PCB and Component 3D Modeling
  • Android
  • Bootloader
  • C/C++
  • DSP Algorithms
  • Java
  • Linux
  • Machine Learning
  • RTOS
  • Block Level System Design and Integration
  • Communications Systems
  • Design for EMI/RFI Immunity
  • Design for Testability
  • Antennas
  • Bluetooth
  • Cellular
  • Certification
  • GPS
  • RF Design
  • WiFi
  • ZigBee
  • Agriculture
  • Automotive
  • Consumer
  • Energy
  • Industrial
  • IoT
  • Medical
  • Telecommunications
  • Transportation
  • NXP
  • Analog Devices
  • NXP
  • STMicro
  • Texas Instruments

Contact

Tanstep Technology
+86 2150850208
Room 410, Building S2, No. 889, Bibo Road, Pudong New Area, Shanghai, 201203, China
Ms. Su
contact@tanstep.com
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