BCM Advanced Research

About

At BCM, we are experts at custom designing computer-based products and have been doing so since our inception in 1990. Whether our customers are looking for a modified standard product, or a full turn-key custom design starting from a concept, we have the expertise and the capabilities to deliver a design that meets the specification, speeds time-to-market, while reducing design risk and design cost.

Our typical designs are based on x86 or ARM technologies and may include a non-standard form factor, specialized I/O, FPGA implementation, or integrating a customer’s IP onto the custom computer board for cost or integration optimization. For ODM systems, it may include metal chassis design, or coming up with an ID design for a plastic housing, tooling, battery design, touch screen implementation, integrating other PCBAs such as a light bar or custom I/O, or memory, CPU, and storage configuration.

We have a proven design cycle methodology that covers each step of the custom design process from concept to production. Our goal is to complete the project on time and on budget through a step-by-step approach with predetermined time allocations for each stage and checkpoints to minimize schedule slips or specification and budget deviations.

Our designs end up in products ranging from small hand-held mobile devices to large scale industrial machines spanning many different market segments. You’ll find our products in devices you encounter daily including self-serve kiosks, vending machines, POS, fitness equipment, video conferencing, 3D printers, security surveillance, medical equipment, airport x-ray scanners, digital signage, slot machines and automated lottery terminals.

With over three decades of OEM/ODM computing design and manufacturing experience, our success as an ODM partner is evident in the companies we do business with and our track record of repeatedly winning new designs within those companies. The strengths we bring include:

  • Your One Stop Shop: Customers define product requirements and specifications, we do design, sourcing, manufacturing production, QC, QA and strategic logistic support.
  • Professional R&D Team: We are proud to have over 30 in-house R&D and experienced project management team members based in Southern California and over 100 worldwide when including our Taiwan based teammates.
  • Intel & NXP Tiered Partner: These partnerships enable us to get early access of new processor platforms, leveraging the latest technologies to help our clients stay ahead of their competitors. In 2020 BCM received a Partner of the Year Award from Intel.
  • Competitive Design Fees: We have flexible volume manufacturing requirements and very competitive engineering design fees. Please contact BCM Sales team for details.
  • Ethernet
  • FPGA
  • General Digital/Analog
  • High Density/BGA
  • PCB Design/Layout
  • Schematic Capture
  • USB
  • Video
  • Design for Manufacturing
  • High Volume Production
  • Low to Medium Volume Production
  • Prototype Assembly
  • Prototype Testing
  • Rapid Prototyping
  • Test Fixture Development
  • Turnkey Volume Production
  • Enclosure Design
  • Full Product 3D Modeling
  • PCB and Component 3D Modeling
  • Android
  • Bootloader
  • Linux
  • Windows
  • Block Level System Design and Integration
  • Aerospace
  • Automotive
  • Food and Beverage
  • Industrial
  • IoT
  • Medical
  • Military
  • Transportation
  • NXP
  • Analog Devices
  • Cypress
  • Infineon
  • Intel
  • Microchip
  • Nordic
  • NXP
  • Semtech
  • STMicro
  • Texas Instruments
  • Xilinx

Contact

11 Chrysler, Irvine, California 92618 USA
Tom Skibinski
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