Assembly Contracts

About

All under one roof:

Design: 3 man team with in depth knowledge.

Approvals Team: whatever your product / market demands we have the necessary approvals ISO, ATEX, FDA, CSA, Aerospace etc.

Prototype and NPI: fast Turnaround 5 day proof of concept facility, small batch NPI supported.

PCBA: High product mix in low, medium and high volumes both SMT and Through Hole plus other technologies.

Box Build: Full Turn-Key service providing fully built and tested final products and distribution.

  • Audio
  • DSP
  • Ethernet
  • FPGA
  • General Digital/Analog
  • High Density/BGA
  • PCB Design/Layout
  • Power Supply
  • Robotics
  • Schematic Capture
  • USB
  • Design for Manufacturing
  • High-Volume Production
  • Low to Medium Production
  • Prototype Assembly
  • Prototype Testing
  • Rapid Prototyping
  • Test Fixture Development
  • Turnkey Volume Production
  • Enclosure Design
  • Full Product 3D Modeling
  • PCB and Component 3D Modeling
  • Android
  • Bootloader
  • C/C++
  • Cloud Services
  • DSP Algorithms
  • Internet Security
  • iOS
  • Java
  • Linxu
  • RTOS
  • Smart Phone Apps
  • VHDL/Verilog
  • Windows
  • Analog Simulation
  • Block Level System Design and Integration
  • Communication Systems
  • Design for EMI/RFI Immunity
  • Design for Testability
  • Antennas
  • Bluetooth
  • Cellular
  • GPS
  • RF Design
  • WiFi
  • ZigBee
  • Aerospace
  • Agriculture
  • Automotive
  • Chemicals
  • Consumer
  • Energy
  • Food and Beverage
  • Government
  • Industrial
  • IoT
  • Marine
  • Medical
  • Military
  • Oil & Gas
  • Telecommunications
  • Transportation
  • Microchip
  • Analog Devices
  • Cypress
  • Infineon
  • Intel
  • Microchip
  • <>
  • Renesas
  • Semtech
  • STMicro
  • Texas Instruments
  • Xilinx

Contact

Roundthorn Ind Est, Ledson Rad, Manchester. UK M23 9GP
Adrian Jones
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