Heat Sinks

Results: 3
Series
-5731
Packaging
BulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)
Type
Board Level, VerticalTop Mount
Package Cooled
TO-220TO-252 (DPak)TO-263 (D²Pak)
Attachment Method
Clip and PC PinSMD Pad
Length
0.315" (8.00mm)0.500" (12.70mm)0.848" (21.55mm)
Width
0.520" (13.21mm)0.900" (22.86mm)1.030" (26.16mm)
Fin Height
0.400" (10.16mm)0.515" (13.08mm)
Power Dissipation @ Temperature Rise
0.8W @ 30°C1.0W @ 30°C1.3W @ 30°C
Thermal Resistance @ Forced Air Flow
6.00°C/W @ 500 LFM10.00°C/W @ 200 LFM12.50°C/W @ 600 LFM
Thermal Resistance @ Natural
18.00°C/W19.70°C/W26.00°C/W
Material
AluminumCopper
Stocking Options
Environmental Options
Media
Marketplace Product
3Results
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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
18,130
In Stock
1 : ¥10.75000
Cut Tape (CT)
250 : ¥8.60980
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
7136DG
7136DG
BOARD LEVEL HEATSINK .515"TO-220
Boyd Laconia, LLC
1,803
In Stock
1 : ¥32.18000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
0.848" (21.55mm)
0.520" (13.21mm)
-
0.515" (13.08mm)
1.0W @ 30°C
6.00°C/W @ 500 LFM
19.70°C/W
Copper
Tin
573300D00010(G)
573300D00010G
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
140
In Stock
Active
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
Showing
of 3

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.