Nexperia's e-mode GaN FETs are designed for low- or high-power conversion applications, offering enhanced power system flexibility.

Nexperia’s Energy Harvesting PMIC uses the advanced Maximum Power Point Tracking (MPPT) algorithm to harvest energy for ultra-low power IoT sensors/nodes. MPPT uses an embedded hill-climbing algorithm to deliver the maximum power to the load.

The Nexperia Recovery Rectifiers deliver a high power density while minimizing reverse recovery time and loss.

Power GaN FET devices can bring multiple benefits to power electronic converters, join Ilian as he compares traditional Silicon-based converters to a GaN-based converter, highlighting the key benefits Power GaN FETs bring to your system.

Presentation on the quality and reliability of Nexperia GaN products.

Leaning on Nexperia's expertise in copper clip technology, Ding Yandoc (Package Architect and Technical Manager) explains all you need to know about CCPAK and why it is the logical next step in high-voltage power FET packaging.

采用夹片键合 FlatPower 封装的 Nexperia 沟槽式肖特基整流器满足了高能效且节省空间的挑战性要求。它们结合了低反向电流、低正向电压和低反向恢复电荷，可在高环境温度下实现出色效率。它们提供三种具有高功率性能的 CFP 封装选项，在更小的封装尺寸中提供了更佳的热性能，可完全替代 SMA 封装。这些 AEC-Q101 认证的整流器是例如 LED 照明、混合动力汽车的动力系统及结温高达 +175 °C 的高温应用等各种汽车、工业、消费和计算应用的理想选择。

Nexperia trench Schottky rectifiers in clip-bonded FlatPower packages meet the challenging demands of efficient and space-saving designs.

Automatic Optical Inspection (AOI) is key to PCB assembly because it verifies the quality of the solder joint, thereby ensuring the robustness of the PCB. If AOI fails to correctly verify the solder it results in a loss of time and money.

Nexperia’s Trench Schottky rectifiers offer excellent switching behavior and low conduction losses, leading thermal performance and extended safe operating area. Making them the ideal choice for automotive applications.

The CFP15B clip-bond FlatPower package is engineered for maximum robustness and reliability under the toughest conditions, making it ideal for automotive applications.

Join Ding as he explains all you need to know about Nexperia's LFPAK56D half-bridge package, PCB connection options, package concept, and key features.

Join Richard as he talks through three MOSFET packages that best fit into the low/medium power automotive motor control application space, discussing the highs and lows of each.

Silicon Germanium (SiGe) rectifiers deliver cutting-edge high efficiency, thermal stability and space-savings. Nexperia’s SiGe rectifiers combine the high efficiency of Schottky rectifiers with the thermal stability of fast recovery diodes.

Nexperia的硅锗整流器，体积小但效率高，并具有优异的电气和热性能。

Nexperia’s silicon-germanium rectifiers provide high efficiency in a small form factor package that provides excellent electrical and thermal performance.

Nexperia’s TrEOS technology optimizes the three pillars of ESD protection: Low capacitance for highest signal integrity, Low clamping and trigger for enhanced system protection, and High robustness against ESD and Surge transients.

High ESD robustness is key to ensuring the reliable, high performance of automotive applications. The trend toward increasing data payload in vehicles due to electrification and connectivity challenges hardware engineers with ESD robustness decrease.

As designs get smaller there is an increasing demand for MOSFETs to have high power capabilities in smaller packages. Reducing the size of components has a great impact on thermal management, as power dissipation must occur on smaller die sizes.

To satisfy an ever-increasing number of electronic functions, vehicles require more semiconductor components. Watch how Nexperia’ s AEC-Q101 qualified leadless packages with side-wettable flanks help save space and minimize weight.