HEATSINK CPU XCUT

Assmann WSW Components

HEAT SINK, BGA, 17 X 17 X 11.5 M

CUI Devices

ALUMINUM HEATSINK FOR JETSON NAN

Seeed Technology Co., Ltd

ALUMINUM EXTRUSION 6"

Ohmite

HEAT SINK, EXTRUSION, TO-220, 25

CUI Devices

HEATSINK CPU XCUT

Assmann WSW Components

HEATSINK CPU XCUT

Assmann WSW Components

HEATSINK CPU XCUT

Assmann WSW Components

HEATSINK CPU XCUT

Assmann WSW Components

HEAT SINK, BGA, 10 X 10 X 7 MM

CUI Devices

HEATSINK CPU XCUT

Assmann WSW Components

HEAT SINK, BGA, 23 X 23 X 10 MM

CUI Devices

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

CUI Devices

HEAT SINK, BGA, 14 X 14 X 6 MM

CUI Devices

HEAT SINK, BGA, 17 X 17 X 6 MM

CUI Devices

HEAT SINK, BGA, 20 X 20 X 9 MM

CUI Devices

HEAT SINK, EXTRUSION, TO-218/TO-

CUI Devices

HEAT SINK, BGA, 21 X 21 X 6 MM

CUI Devices

CPU HEATSINK, CROSS CUT, AL6063,

Assmann WSW Components

HEAT SINK, BGA, 27 X 27 X 6 MM

CUI Devices

HEAT SINK, BGA, 12 X 12 X 18 MM

CUI Devices

HEAT SINK, BGA, 21 X 21 X 15 MM

CUI Devices

HEAT SINK, EXTRUSION, TO-220/TO-

CUI Devices

HEAT SINK, BGA, 18 X 18 X 10 MM

CUI Devices

HEAT SINK, EXTRUSION, TO-220, 38

CUI Devices