Prototype Boards Perforated

Results: 4
Manufacturer
Bud IndustriesChip Quik Inc.SparkFun ElectronicsVector Electronics
Series
-EXNProto-AdvantageVectorbord® Circbord™
Plating
Non-Plated Through Hole (NPTH)Plated Through Hole (PTH)
Circuit Pattern
5 Hole Pad (Both Sides)Pad Per Hole (Round)
Hole Diameter
0.039" (1.00mm)0.042" (1.07mm)0.051" (1.30mm)-
Size / Dimension
2.83" L x 2.10" W (71.9mm x 53.3mm)3.60" L x 2.30" W (91.4mm x 58.4mm)4.00" L x 4.00" W (101.6mm x 101.6mm)-
Board Thickness
0.062" (1.57mm) 1/16"0.063" (1.60mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Plating
Pitch
Circuit Pattern
Edge Contacts
Hole Diameter
Size / Dimension
Board Thickness
8015-1
8015-1
BREADBOARD GENERAL PURPOSE NPTH
Vector Electronics
294
In Stock
1 : ¥74.22000
Bulk
Bulk
Active
Breadboard, General Purpose
Non-Plated Through Hole (NPTH)
0.100" (2.54mm)
Pad Per Hole (Round)
-
0.042" (1.07mm)
4.00" L x 4.00" W (101.6mm x 101.6mm)
0.062" (1.57mm) 1/16"
SBB400
SBB400
BREADBOARD GENERAL PURPOSE PTH
Chip Quik Inc.
465
In Stock
1 : ¥33.92000
Bulk
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm)
5 Hole Pad (Both Sides)
-
0.039" (1.00mm)
3.60" L x 2.30" W (91.4mm x 58.4mm)
0.063" (1.60mm)
EXN Series
EXN-23401-PCB
BREADBOARD GENERAL PURPOSE NPTH
Bud Industries
391
In Stock
17
Factory
1 : ¥36.12000
Bulk
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm)
Pad Per Hole (Round)
-
0.051" (1.30mm)
2.83" L x 2.10" W (71.9mm x 53.3mm)
0.063" (1.60mm)
PRT-12699
PRT-12699
BREADBOARD GENERAL PURPOSE PTH
SparkFun Electronics
24
In Stock
1 : ¥81.69000
Bulk
-
Bulk
Active
Breadboard, General Purpose
Plated Through Hole (PTH)
0.100" (2.54mm)
5 Hole Pad (Both Sides)
-
-
-
-
Showing
of 4

Prototype Boards Perforated


Products in this category are used as a platform for circuit construction in hobby, experimental, and similar settings where adaptability is desired. Characterized by having a series of holes drilled through their thickness at regular intervals, they may also include a solderable conductive layer around these holes, which may or may not be interconnected, depending on the nature of a specific product. Often used for constructing circuits based on through-hole component packaging, similar products lacking perforation are more commonly used for circuit development using surface mounted components.