IC Sockets

Results: 4
Manufacturer
Mill-Max Manufacturing Corp.On Shore Technology Inc.TE Connectivity AMP Connectors
Series
110Diplomate DLED
Type
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.4" (10.16mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
16 (2 x 8)20 (2 x 10)24 (2 x 12)28 (2 x 14)
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
30.0µin (0.76µm)60.0µin (1.52µm)100.0µin (2.54µm)
Contact Material - Mating
Beryllium CopperPhosphor Bronze
Contact Finish Thickness - Post
60.0µin (1.52µm)200.0µin (5.08µm)-
Contact Material - Post
Brass AlloyBrass, CopperPhosphor Bronze
Housing Material
Polybutylene Terephthalate (PBT), Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 110°C-55°C ~ 125°C-40°C ~ 105°C
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1,284
In Stock
1 : ¥14.04000
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Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
518
In Stock
1 : ¥28.24000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1-2199298-4
1-2199298-4
CONN IC DIP SOCKET 16POS TIN
TE Connectivity AMP Connectors
2,668
In Stock
1 : ¥1.89000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
ED20DT
ED20DT
CONN IC DIP SOCKET 20POS TIN
On Shore Technology Inc.
23,090
In Stock
1 : ¥2.87000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
Showing
of 4

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.