Edgeboard Connectors

Results: 2
Manufacturer
Amphenol ICC (FCI)TE Connectivity AMP Connectors
Packaging
Cut Tape (CT)Tape & Reel (TR)Tray
Card Type
M.2 (NGFF) Mini CardPCI Express™
Number of Positions
6467
Card Thickness
0.062" (1.57mm)-
Pitch
0.020" (0.50mm)0.039" (1.00mm)
Features
Board GuideBoard Guide, Locking Ramp, Pick and Place, Solder Retention
Mounting Type
Surface MountSurface Mount, Right Angle
Contact Finish Thickness
15.0µin (0.38µm)30.0µin (0.76µm)
Contact Type
-Cantilever
Operating Temperature
-55°C ~ 85°C-40°C ~ 80°C
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Card Type
Gender
Number of Positions/Bay/Row
Number of Positions
Card Thickness
Number of Rows
Pitch
Read Out
Features
Mounting Type
Termination
Contact Material
Contact Finish
Contact Finish Thickness
Contact Type
Color
Flange Feature
Operating Temperature
1-2199230-6
1-2199230-6
CONN M.2 FMALE 67POS 0.020 GOLD
TE Connectivity AMP Connectors
15,864
In Stock
1 : ¥15.93000
Cut Tape (CT)
1,000 : ¥10.41283
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Active
M.2 (NGFF) Mini Card
Female
-
67
-
2
0.020" (0.50mm)
Dual
Board Guide
Surface Mount, Right Angle
Solder
Copper Alloy
Gold
30.0µin (0.76µm)
-
Black
-
-40°C ~ 80°C
10061913-111CLF
10061913-111CLF
CONN PCI EXP FMALE 64POS 0.039
Amphenol ICC (FCI)
0
In Stock
Check Lead Time
1 : ¥34.24000
Tray
-
Tray
Active
PCI Express™
Female
-
64
0.062" (1.57mm)
2
0.039" (1.00mm)
Dual
Board Guide, Locking Ramp, Pick and Place, Solder Retention
Surface Mount
Solder
Copper Alloy
Gold
15.0µin (0.38µm)
Cantilever
Black
-
-55°C ~ 85°C
Showing
of 2

Edgeboard Connectors


Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.