Adapter, Breakout Boards

Results: 2
Package Accepted
LGAMiniSOIC
Pitch
0.026" (0.65mm)0.050" (1.27mm)
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.400" W (10.16mm x 10.16mm)0.700" x 0.400" (17.78mm x 10.16mm)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
PA0170C
PA0170C
MINI SOIC-8 EXP PAD TO DIP-8 SMT
Chip Quik Inc.
29
In Stock
1 : ¥54.92000
Bulk
Bulk
Active
SMD to DIP
MiniSOIC
8
0.026" (0.65mm)
-
-
0.400" L x 0.400" W (10.16mm x 10.16mm)
PA0098
PA0098
LGA-8 TO DIP-8 SMT ADAPTER
Chip Quik Inc.
2
In Stock
1 : ¥34.40000
Bulk
Bulk
Active
SMD to DIP
LGA
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.400" (17.78mm x 10.16mm)
Showing
of 2

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.