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Many factors come into play in circuit design with respect to etching, surface finishing and mechanical fabrication processes; such as holes, flatness, singulation and tolerances.
Thermal properties and testing white paper from Bergquist.
Most applications of copper clad insulated metal substrates use an aluminum base.
Epoxy flux technology tacky flux with value added benefits from Multicore.
Recently, the focus of attention in the IC packaging industry has been squarely on removing costs from the manufacturing supply chain
Henkel's solder materials science gets small as miniaturization challenges old rules.
Though the electronics industry is nearing the three-year anniversary marking the ban of lead from electronics products, several challenges remain with existing lead-free materials for certain applications from Henkel.
