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The MicroLeadFrame® package (MLF®) is a near CSP plastic encapsulated package with a copper leadframe substrate.
This application note includes a detailed description of the NV6169 and GaNSense functions, schematics and PCB layout guidelines, in-circuit examples and waveforms, and thermal management instructions.
This application note includes PCB layout guidelines and examples to help designers to design for correct thermal management for NV6123/25/27. These guidelines are intended to extract maximum efficiency and power density when using GaN Power ICs.
This application note includes a detailed description of each new GaNSense function, schematics and PCB layout guidelines, in-circuit examples and waveforms, and thermal management instructions.
This application note includes correct PCB layout guidelines and power supply examples to help designers correctly design for correct thermal management.
