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Shiu Li Technology

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T 系列高导热间隙垫

Shiu Li Technology 提供 LiPOLY T 系列高导热间隙垫,旨在应用于 CPU/组件与散热器之间。

N 系列无硅高导热间隙垫

Shiu Li Technology 的 N 系列无硅胶导热间隙垫专为硬盘驱动器、光学设备、电动汽车等应用而设计。

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关于 Shiu Li Technology

Shiu Li Technology is a world-leading thermal management manufacturer. We’ve developed a comprehensive and extremely competitive product line including gap pads, gap fillers, thermal grease, insulator pads, and thermal adhesives. We specialize in creating light and thin thermal management materials for high powered modules. Shiu Li has the ability to customize thermal conductive products to meet our customers’ special requirements on advanced products. With over 20 years of research and development experience, we ensure you always receive very high quality thermal interface materials.

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