The inside of the power module contains many components. Some modules contain a full bridge as shown in the 3-phase bridge. In some cases there is only an H-bridge with the gate driver IC and peripheral components. Additionally, there is a transistor which is used for protection for over temperature. This transistor can be linked directly with a driver IC or it can be made available for software. Some modules have shunts inside the package while some have an open collector so the shunt can be added as an external component.