This pictorial shows which features are enabled in specific packages. Some packages are defined to be more generic FPGA offerings, while others are more specific to the MIPI/CSI and/or DDR DRAM function blocks. At the top right, are the smaller T4 and T8 offerings, with primarily GPIO and PLL for the specialized functions offered in those packages. Obviously, they also have multipliers and embedded memory block available to users, as all the devices will have of varying size and quantity of those features. On the bottom right and top left are highlighted some of the packages that incorporate unique hardened blocks. The BGA169 package, top left, has two RX/TX hard core blocks, while the BGA324 on the bottom right has added x16 bit DDR DRAM controller in addition to the CSI blocks. The BGA256 is a generic FPGA offering that is an optimum device for the I/O intensive needs, as there are many GPIOs available for the customers design. All the packages on the bottom row have differing logic element sizes as denoted, ranging from 13 K LE to 35 K LE.