Shown here is the Trion® Family Product table. The Specific device names (T4, T8, T13, T20) are on the top of the table, and the characteristics for each of those devices are listed on the left side. The table illustrates the resources available for each device, such as Embedded Memory size, GPIO count, and Multiplier count. Devices supporting hardened cores for MIPI/CSI and DDR memory controllers are shown, although some of them are package specific, which will be highlighted later. The T4 and T8 on the left side of the table are in especially small packages and especially low power, as they are produced on a special low voltage 40 nm process. They still use the same Quantum XLR fabric, but they are more minimalistic in their features and are targeted for hand-held, control plane functions. The T13 and T20 and larger devices have the MIPI/CSI and the DDR Memory controller hardened functions, depending on package. The T20/T13 have two MIPI/CSI controllers with independent Tx/Rx and the larger devices/packages have 3 controllers. Devices in the same package have migration capability, where the IOs of smaller devices will match up to in the larger devices. This allows the customer to move to larger devices for prototype, and then move down to smaller devices for production, for lowest cost and flexibility for testing out multiple scenarios in debug.